3D IC Market Size, Share & Industry Analysis, By Technology (Through-Silicon Via (TSV), 3D Fan-Out Packaging, 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP), Monolithic 3D ICs, and Others), By Component (3D Memory, LEDs, Sensors, Processors, and Others), By Application (Logic and Memory Integration, Imaging and Optoelectronics, MEMS and Sensors, LED包装等），由最终用户（消费电子，IT和电信，汽车，医疗保健，航空和国防，工业等）以及区域预测，2025- 2032