3D IC Market Size, Share & Industry Analysis, By Technology (Through-Silicon Via (TSV), 3D Fan-Out Packaging, 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP), Monolithic 3D ICs, and Others), By Component (3D Memory, LEDs, Sensors, Processors, and Others), By Application (Logic and Memory Integration, Imaging and Optoelectronics, MEMS and Sensors, LED Verpackung und andere) nach Endbenutzer (Unterhaltungselektronik, IT und Telekommunikation, Automobile, Gesundheitswesen, Luft- und Raumfahrt und Verteidigung, Industrie und andere) und regionale Prognose, 2025–2032