3D IC Market Size, Share & Industry Analysis, By Technology (Through-Silicon Via (TSV), 3D Fan-Out Packaging, 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP), Monolithic 3D ICs, and Others), By Component (3D Memory, LEDs, Sensors, Processors, and Others), By Application (Logic and Memory Integration, Imaging and Optoelectronics, MEMS and Sensors, LED Embalaje y otros), por usuario final (Electrónica de consumo, TI y telecomunicaciones, automotriz, atención médica, aeroespacial y defensa, industrial y otros), y pronóstico regional, 2025–2032