Semiconductor IC Packaging Materials Market Size, Share, and Industry Analysis By Type (Organic substrate, Bonding wires, Lead frames, Encapsulation resins, Ceramic packages, Die Attach materials, Thermal interface materials, and Others), By Packaging Technology (Wire bonding, Flip-Chip packaging, Wafer-level packaging (WLP), System-in-package (Sip), and Others), By End-use Industry (Aerospace & Defense, Automotive, Consumer electronics, Healthcare, IT & telecommunication, and Others), and Regional Forecast, 2026-2034