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Wi-Fi Chipset Market Size, Share & Industry Analysis By Type (IEEE 802.11BE, IEEE 802.11AX, IEEE 802.11AC, IEEE 802.11AD, IEEE 802.11B/G/N), By Band (Single Band, Dual Band, Triband), By Application (Consumer Devices, Smart Home Devices, Gaming Devices, AR/VR Devices), By End-use Industry (Consumer Electronics, Banking, Financial Services, and Insurance, Healthcare, Enterprise) And Regional Forecast, 2024-2032

Report Format: PDF | Published Date: Ongoing | Report ID: FBI106478 | Status : Upcoming

Wireless chipset is a part of hardware device that allows a device to communicate with another wireless-enabled device. It is used in fixed broadband wireless access networks that use point-to-multipoint architecture. Significant adoption of Wi-Fi in business, rise in number of internet of things (IoT), growing number of public Wi-Fi hotspots, and increasing need for high speed data transfer are driving the growth of the market. Additionally, many vendors provide Wi-Fi 6 and 6E products that are designed to deliver blazing fast speed and meet customers demand. Growing usage of internet and mobile devices among end-users is significantly high which plays an important role to boost the growth of Wi-Fi chipset market.


Rise in digitization and growing use of smart electronic devices plays an important role to increase the demand for Wi-Fi chipset. Over the last few years, the time spend by smartphone users on Wi-Fi rather than on cellular networks has significantly increased. According to telecom advisory services, in the United States, the percentage of time spent by a smartphone user on Wi-Fi jumped from 54.3% to 59.9% and in Brazil, the number has increased by 11%. Furthermore, government of various countries are focusing on developing smart city project and deploying free Wi-Fi to connect entire city is creating lucrative opportunity for the market growth. In addition, use of public Wi-Fi provides better access for education facility in a more accessible form which is expected to propel the growth of the market.


IMPACT OF COVID-19 ON Wi-Fi CHIPSET MARKET


The COVID-19 had positive impact on the Wi-Fi chipset market. Government of various countries had imposed lockdown due to which many enterprises, automotive, retail, BFSI, and other sectors were badly affected. COVID-19 has forced many countries to re-examine social practices and production systems. The International Monetary Fund (IMF, 2020) estimates that the global economy will contract by 4.70% in 2020, however it will bounce back with 4.80% growth in 2021. Growing digitization across the globe is anticipated to mitigate the economic losses triggered by natural emergencies. Post Covid-19 offices, schools, and factories were closed to curb the spread of the novel corona virus. This has led to significant increase in telecommunication and in data traffic from households and businesses. Thus, it is analyzed that post COVID-19 demand for Wi-Fi connectivity for business, education, video streaming has significantly increased among all end-users and it is expected to drive the market during forecast period.


REGIONAL ANALYSIS



North America is expected hold the largest market share in the global market. Rising need for a smart devices and equipment is anticipated to boost the demand for Wi-Fi chipset market in this region. The presence of major market players such as Broadcom Inc., Hewlett Packard Enterprise Co., Intel Corporation, Qualcomm Technologies, Inc., and Texas Instruments, Inc. in the region is boosting the growth of the market. These players are involved in partnership, acquisitions, developing new products and product enhancement to maintain their position in the market. For instance, in January 2021, Broadcom Inc. announced the launch of the world’s first Wi-Fi 6E phone, the Samsung Galaxy S21 Ultra, enabled with BCM4389 chip. The BCM4389 chip offers the benefit of 6th generation of Wi-Fi with high data transfer speed.


Asia Pacific is anticipated to grow at highest CAGR during forecast period. Presence of major Wi-Fi enabled original equipment manufacturers (OEMs) across China, India, Singapore, South Korea and others are expected to drive the market growth rapidly in this region. In addition, availability of Wi-Fi chipset at lower cost is propelling demand for Wi-Fi chipset in the region.


KEY PLAYERS COVERED


The report will include the profiles of key players such as Broadcom Inc., Cisco Systems Inc., CommScope Holding Co., Cypress Semiconductor Corporation, Dell Technologies, Hewlett Packard Enterprise Co., Intel Corporation, MediaTek Inc., NXP Semiconductors N.V., On Semiconductor, Peraso Technologies, Inc., Qualcomm Technologies, Inc., STMicroelectronics N.V., Samsung Electronics Co., Ltd., Skyworks Solutions, Inc., Qualcomm Technologies, Inc., and Texas Instruments, Inc. and others.


Key players in the market like CommScope Holding Co., Cypress Semiconductor Corporation, NXP Semiconductors N.V., On Semiconductor etc. are entering into strategic partnerships and collaborations to expand the business. Market players are focused on new product launch and product enhancement in existing product to accelerate market growth


SEGMENTATION






























  ATTRIBUTE


  DETAILS

By Type




  • IEEE 802.11BE

  • IEEE 802.11AX

  • IEEE 802.11AC

  • IEEE 802.11AD

  • IEEE 802.11B/G/N



By Band




  • Single Band

  • Dual Band

  • Triband



By Application




  • Consumer Devices

  • Smart Home Devices

  • Gaming Devices

  • AR/VR Devices

  • Networking Devices

  • Others



By End-use Industry




  • Consumer Electronics

  • Banking, Financial Services, and Insurance

  • Healthcare

  • Enterprise

  • Retail

  • Automotive

  • Industrial

  • Others



By Geography




  • North America (U.S., Canada, and Mexico)

  • Europe (United Kingdom, Germany, France, Italy, Spain, Russia, Benelux, Nordics and Rest of Europe)

  • Asia Pacific (China, India, Japan, South Korea, ASEAN, Oceania and Rest of Asia Pacific)

  • Middle East & Africa (Turkey, Israel, GCC, North Africa, South Africa and Rest of MEA)

  • South America (Brazil, Argentina and Rest of South America)



KEY INDUSTRY DEVELOPMENTS



  • October 2020- NXP Semiconductors N.V. introduced a new 2x2 Wi-Fi 6 Dual Band and Bluetooth solution that provides multiple benefits such as transmission of data at high speed of 1.2 Gbps with low power.

  • January 2019- Cypress Semiconductor Corporation launched a new wireless connectivity chipset for automotive infotainment. The chipset is enabled with Bluetooth and Wi-Fi 6 connectivity solution that enable multiple users to connect as many as 10 mobile devices simultaneously.

  • Global
  • 2023
  • 2019-2022
  • PRICE
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