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Dicing Die Attach Film Market Size, Share & Industry Analysis, By Type (Non-Conductive Type, Conductive Type), By Application (Die to Substrate, Die to Die, Film on Wire, Others) And Regional Forecast, 2024-2032

Region :Global | Report ID: FBI105352 | Status : Ongoing



Dicing die attach film is the combination of die attach film and dicing tape. Whereas, the die attach film is an adhesive film, which is highly utilized in the process of the semiconductor. Moreover, the optimization of dicing tape on the die attach film aid to providing excellent pick-up performance, enables wafer mounting, integrate with pressure-sensitive dicing tape, and enables label shaping. The dicing process also helps to blade and stealth laser dicing. The dicing die attach film is available in conductive and non-conductive categories. It is mainly used in die to substrate, die to die, and film on wire applications.

The rising demand for die-attach film in the process of the semiconductor will boost the consumption of dicing die attach film. The addition of dicing tape on die attach film leads to achieve high reliability. In the semiconductor assembly process, the product is used for fixing IC chips to interpose or lead frame. Further, it is also useful in solving conventional silver paste bleeding problems, which cause short circuits and in realizing high adhesive reliability in BOC and stacked CSP manufacturing processes. Hence, increasing demand of die attach film in the semiconductor process will aid to fuel the dicing die attach film market growth during the review period.

However, low awareness amongst the people about the benefits and use of dicing die attach film is restricting its adoption in various applications. Hence, this is anticipated to hamper the market growth.

Key Market Driver -

The rising demand for die attach film in semiconductor process to drive the product demand.

Key Market Restraint -

Unawareness about the product to hamper the market growth

Market Segmentation:

Based on type, the dicing die attach film market is segmented into non-conductive type and conductive type. Based on application, the market is segmented into die to substrate, die to die, film on wire, and others. From a geographical standpoint, the market is categorized into North America, Europe, Asia Pacific, Latin America, and the Middle East & Africa.  

Key Players Covered:

The key players in the dicing die attach film market include Marketexpertz, AI Technology, Inc., NITTO DENKO CORPORATION, Promex Industries, CAPLINQ Corporation, THAI HIBEX CO., LTD,  U.S. Tech., LINTEC ADVANCED TECHNOLOGIES (EUROPE) GmbH, Integra Technologies, FURUKAWA ELECTRIC CO., LTD, SMTnet, and Epak Electronics Ltd.

Key Insights

  • Key Emerging Trends – For Major Countries

  • Key Developments: Mergers, Acquisition, Partnership, etc.

  • Latest Technological Advancement

  • Insights on Regulatory Scenarios

  • Porters Five Forces Analysis

Regional Analysis:

Asia Pacific is anticipated to witness sustainable growth in the dicing die attach film market. The growth is attributed to the rising use of conductive based dicing die attach film in the semiconductor process. The increasing product use in the die to substrate application will fuel the market growth in Europe. The rising adoption of non-conductive based dicing die attach film in the die to die application will propel the market growth in North America, in which the US and Canada are the leading countries. The Middle East & Africa is anticipated to witness significant growth, owing to rising product utilization in the film on wire application.

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By Type

  • Non-Conductive Type

  • Conductive Type

By Application

  • Die to Substrate

  • Die to Die

  • Film on Wire

  • Others

By Geography

  • North America (U.S. and Canada)

  • Europe (UK, Germany, France, Italy, Spain, and Rest of Europe)

  • Asia Pacific (Japan, China, Taiwan, India, South Korea, Southeast Asia, and Rest of Asia Pacific)

  • Latin America (Brazil, Mexico, and Rest of Latin America)

  • Middle East & Africa (South Africa, GCC, and Rest of the Middle East & Africa)

Dicing Die Attach Film Industry Developments

  • In August 2017, Furukawa Electric Co., Ltd. started its mass production of Stealth Dicing Tape. The product is mainly use with semiconductors. This lauch will help the company in the separation of IC chips from wafers after the stealth dicing process.

  • Ongoing
  • 2023
  • 2019-2022

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