Die Bonder Equipment Market Size, Share, and Industry Analysis, By Product Type (Semi-automatic and Fully-Automatic), By End-Users (Integrated Device Manufacturers, OSATs, and Foundries), By Industry (Consumer Electronics, Automotive, Industrial, Telecommunications, Healthcare, and Aerospace & Defense), and Regional Forecast, 2026-2034

The global die bonder equipment market size was valued at USD 1.98 billion in 2025. The market is projected to grow from USD 2.05 billion in 2026 to USD 2.73 billion by 2034, exhibiting a CAGR of 3.65% during the forecast period.

The Global Die Bonder Equipment Market is to witness strong growth during the forecast period as a result of rising demand for semiconductor devices in consumer electronics, automotive, and other IoT devices. The growing miniaturization of electronic products and the complexity of semiconductor chip designs support the demand for die-bonder equipment across geographies.

• For instance, Global Semiconductor sales grew by double digits with year-on-year growth of 18.7% in July 2024 compared to July  2023. The semiconductor industry sales have hit USD 51.3 billion in July 2024.
• For instance, India’s Uttar Pradesh state has attracted about USD 4.79 billion to promote investment in chip manufacturing. Companies such as Tarq Semiconductors Pvt Ltd., Kaynes Semicon Pvt Ltd., Aditech Semiconductor Pvt Ltd., and Vama Sundari Investment Delhi Pvt Ltd. have investments in chip manufacturing.

Die Bonder Equipment Market Driver

Growing Demand for Die Bonding Machines Owing to Diverse Industry Applications Including Consumer Electronics, Automotive, and Telecommunications 

Advanced semiconductor packaging solutions and the adoption of semiconductor devices in electronics and IoT are all supporting the market demand for die bonder equipment. Young demographics and their purchase behavior of consumer electronics and other products further bolstered the market demand for semiconductor chips. Mobile devices, accessories, specialty electronics equipment, home entertainment devices, and other such products are further generating demand for die-bonded semiconductor chips. All such factors are responsible for enhancing the production of semiconductor chips, resulting in increased demand for die bonder machines. Key government initiatives, investment in semiconductor fabrication, and supportive regulatory policies are all propelling the demand for die-bonding equipment.

• For instance, the Indian government has a production-linked Incentive (PLI) scheme with a total investment of about USD 727.6 million as of June 2023, along with government programs such as ‘Digital India’ and ‘Make in India’.

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According to World Semiconductor Trade Statistics, the evolution of the industry and technologically advanced products and process technologies are boosting the growth of the die bonder equipment market. Computers accounted for the highest share of semiconductor sales globally in 2021.  

Die Bonder Equipment Market Restraint

High Initial Investment and Maintenance Cost Might Hinder the Market Growth 

Initial investment for die bonding technology is very high, resulting in a high ownership cost. Lack of standardization and demand for a skilled workforce further limit the market growth for the die bonding machine. Die bonder equipment increases the operational cost for end users owing to its rising maintenance costs, which might limit the market growth. 

Die Bonder Equipment Market Opportunity

Rising Investment in Smart Manufacturing Solutions and Integration with Industry 4.0 Technologies are Surging the Market Demand. 

High-precision die bonder equipment integrated with semiconductor devices would further generate strong growth for the market. The rapid adoption of smart manufacturing and IoT-based connected systems are expected to gain market traction during the forecast period, resulting in huge demand for semiconductor manufacturing equipment such as die bonding equipment. IoT Devices are witnessing strong growth across manufacturing facilities catering to unique needs such as equipment performance monitoring and inventory level tracking.

• For instance, Siemens AG announced an investment of about USD 150 million in a smart factory in Dallas to supply electrical equipment.

Segmentation

Key Insights

The report covers the following key insights:

• Micro Macro Economic Indicators
• Drivers, Restraints, Trends, and Opportunities
• Business Strategies Adopted by the Key Players
• Consolidated SWOT Analysis of Key Players

Analysis by Product Type

By product type, the market is divided into semi-automatic and fully-automatic.

Automatic die bonder equipment caters to the highest revenue market share, which is primarily driven by the high demand for precise and efficient manufacturing of semiconductors. Automatic machines aid in critical tasks such as accurate die placement, high-speed bonding, flexibility in different die sizes, and working with varied substrates. Semi-automatic die bonders to witness steady growth during the forecast period as a result of increasing application across industries such as consumer electronics and automotive electronics.

Analysis by End-Users

By end-users, the market is divided into integrated device manufacturers, OSATs, and foundries.

Integrated Device Manufacturers, also known as IDMs, account for the highest revenue market share owing to the design and production of semiconductors. As a result of increasing semiconductor designs, the need for miniaturization and demand for high-performance computing technologies are bolstering the growth of die-bonding equipment. IDMs are largely responsible for designing and manufacturing semiconductors, catering to the highest revenue market share. OSATs are to experience considerable growth for die bonding equipment during the forecast period.

Analysis by Industry

By industry, the market is divided into consumer electronics, automotive, industrial, telecommunications, healthcare, and aerospace & defense.

Advancements in microelectronic devices, the growing trend for component miniaturization, and the introduction of 5G technology bring strong market opportunities for die bonder equipment. Rising demand for consumer electronic products and automation will surge the growth of die bonder equipment in the consumer electronic industry. Increasing fuel prices and focusing on electric vehicles are further boosting the demand for electric vehicles, generating volume sales of die bonder equipment.

Regional Analysis

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In terms of geography, the global market is segmented into North America, Europe, Asia Pacific, South America, and the Middle East & Africa.

Growing investments in semiconductor manufacturing, supportive initiatives, and subsidies support the market demand for die bonder equipment in Asia Pacific. Considerable growth for consumer electronics and the growing adoption of advanced technologies are all surging the demand for die bonder equipment.

• In May 2024. China has announced an investment of about USD 48 billion in a semiconductor fund launched by the China Integrated Circuit Industry Investment Fund.

North America and Europe will witness significant growth during the forecast period as a result of a strong focus on automotive manufacturing and industrial electronics.

• European Union has planned to invest about USD 241.12 billion to support research and development activities in semiconductors, microelectronics, and photonics.

Several supporting initiatives, a strong supply chain across trade borders, and increasing investment in semiconductor manufacturing propel the market growth for Die Bonder Equipment across diverse geographic locations.

Key Players Covered

The global Die Bonder Equipment market is fragmented, with a large number of regional and local players. In China, the top 5 players account for around 45% -50% of the market.

The report includes the profiles of the following key players:

• Besi (Netherlands)
• ASM Pacific Technology Limited (China)
• Kulicke & Soffa Industries, Inc. (U.S.)
• Tresky AG (Switzerland)
• Shibaura Mechatronics Corporation (Japan)
• West-Bond, Inc. (U.S.)
• MRSI Systems (U.S.)
• Shinkawa Ltd. (Japan)
• Palomar Technologies (U.S.)
• Dias Automation Ltd. (China)

Key Industry Developments

• In July 2022, MRSI Systems introduced a new die bonder equipment, MRSI-H-HPLD+, with high-power laser die attachment applications.
• In 2020, MRSI Systems recognized the MRSI-S-HVM submicron die bonder and won “The Most Competitive Optical Communication Product.