Wide Band Gap Semiconductor Market Size, Share & Industry Analysis, By Material Type (Silicon Carbide (SiC), Gallium Nitride (GaN), and Others), By Device Type (Power Devices, RF Devices, and Optoelectronic Devices), By End-user (Automotive, Consumer Electronics, Telecommunications, Aerospace & Defense, Energy & Power, and Others) and Regional Forecast, 2025 – 2032

ATTRIBUTE

DETAILS

Study Period

2019-2032

Base Year

2024

Estimated Year

2025

Forecast Period

2025-2032

Historical Period

2019-2023

Unit

Value (USD Billion)

Growth Rate

CAGR of 14.7% from 2025 to 2032

Segmentation

By Material Type

• Silicon Carbide (SiC)
• Gallium Nitride (GaN)
• Others (Aluminium Nitride (AIN), Diamond, etc.)

By Device Type

• Power Devices
• RF Devices
• Optoelectronic Devices

By End-user

• Automotive
• Consumer Electronics
• Telecommunications
• Aerospace & Defense
• Energy & Power
• Others (Healthcare)

By Region

• North America (By Material Type, By Device Type, By End-user, and Region)
  • U.S. (By End-user)
  • Canada (By End-user)
  • Mexico (By End-user)
• South America ((By Material Type, By Device Type, By End-user, and Region)
  • Brazil (By End-user)
  • Argentina (By End-user)
  • Rest of South America
• Europe ((By Material Type, By Device Type, By End-user, and Region)
  • U.K. (By End-user)
  • Germany (By End-user)
  • France (By End-user)
  • Italy (By End-user)
  • Spain (By End-user)
  • Russia (By End-user)
  • Benelux (By End-user)
  • Nordics (By End-user)
  • Rest of Europe
• Middle East & Africa ((By Material Type, By Device Type, By End-user, and Region)
  • Turkey (By End-user)
  • Israel (By End-user)
  • GCC (By End-user)
  • North Africa (By End-user)
  • South Africa (By End-user)
  • Rest of the Middle East & Africa
• Asia Pacific ((By Material Type, By Device Type, By End-user, and Region)
  • China (By End-user)
  • Japan (By End-user)
  • India (By End-user)
  • South Korea (By End-user)
  • ASEAN (By End-user)
  • Oceania (By End-user)
  • Rest of Asia Pacific

Companies Profiled in the Report

• Infineon Technologies AG (Germany)
• STMicroelectronics (Switzerland)
• Analog Devices, Inc. (U.S.)
• NXP Semiconductors (Netherlands)
• ROHM Co., Ltd. (Japan)
• Macom Technology Solutions (U.S.)
• TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION (Japan)
• Mitsubishi Electric (Japan)
• Fuji Electric Co., Ltd. (Japan)
• Vishay Intertechnology, Inc. (U.S.)
• Nexperia (Netherlands)
• KYOCERA AVX Components Corporation (U.S.)