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Solder Preform Market Size, Share & Industry Analysis, By Type (Lead, Lead-free), By Application (Military & Aerospace, Medical, Semiconductors, Electronics, Others) and Regional Forecast, 2022-2029

Region : Global | Report ID: FBI103013 | Status : Ongoing

 

KEY INDUSTRY INSIGHTS

Solder is a fusible metal alloy which creates a permanent link between two or more metal workpieces. Solder perform is a pre-made shape of solder that is designed for special applications. Combination of machine technologies which include rolling, pressing, and other techniques are used to manufacture solder alloy in various shapes and sizes. It also provides accurate deposition of various soldering processes.


Due to the massive growth in the electronic sector, there has been substantial growth in the demand for solder preform which is expected to drive the overall market potentially. Extensive R&D in the medical sector along with technological advancement in soldering techniques shall foster the market growth.


Key Market Driver -

Growth in the electronics sector.

Key Market Restraint -

Threats of new and advanced substitutes.


However, threats by the new and advanced technologies and substitutes for solder preform is likely to hamper the market growth.


Market Segmentation:


Based on type, the market is segmented into lead and lead-free. Based on application, the market is segmented into military & aerospace, medical, semiconductor, electronics and others.


From a geographical standpoint, the market is categorized into North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa.


Key Players Covered:


The global solder preform market is fairly consolidated, with a number of global & regional players operating. Some of the key players in the material market includes Nihon Superior, AMETEK Coining, Fromosol, AIM, Solderwell Advanced Materials, Shanghai Huaqing, Indium Corporation, and Others.


Key Insights



  • New Advancements in Production Technologies

  • Key Trends in the Solder Preform Market

  • New Product Launches, Expansions, Key Players

  • Ranking of Key Players in the Market


Regional Analysis:


The market has been segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. Asia Pacific is likely to be the largest market for the solder preform due to the rapid industrialization in China and India. North America is expected to show significant growth attributed to the technological advancement and R&D in electronics. Europe is expected to show considerable growth due to the industrial growth in European regions. Latin America and Middle East & Africa is estimated to show sluggish growh owing to lack of exposure to advanced technologies.


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Segmentation






















 ATTRIBUTE


 DETAILS

By Type




  • Lead

  • Lead-free



By Application




  • Military & Aerospace

  • Medical

  • Semiconductors

  • Electronics

  • Others



By Geography




  • North America (U.S., and Canada)

  • Europe (Germany, UK, France, Italy, Spain, and Rest of Europe)

  • Asia Pacific (Japan, China, India, and Rest of Asia Pacific)

  • Latin America (Mexico, Brazil, and Rest of Latin America)

  • Middle East & Africa (South Africa, and Rest of Middle East & Africa)



Solder Preform Industry Developments



  • AIM’s offers specialty solder products which are available in various alloys with melting temperatures ranging from 10°C to 400°C including wire, foil or ribbon, solder preforms, and solder paste forms.


 


  • Ongoing
  • 2021
  • 2018-2020

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