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Wire Bonder Equipment Market Size, Share & Industry Analysis, By Type (Ball Bonders, Stud-Bump Bonders, Wedge Bonders), By Application (Integrated Device Manufacturers (IDMs), Outsourced Semiconductor Assembly and Testing (OSATs)) And Regional Forecast 2022-2029

Region : Global | Report ID: FBI104767 | Status : Ongoing

 

KEY INDUSTRY INSIGHTS

Wire bonder equipment is mostly used to interconnect the semiconductor device or IC (Integrated Circuits) while chip packaging. This is a primary interconnection between the electronic chips and circuits, that ensures appropriate flow of electricity across the semiconductor device.This equipment is loaded with a thin wire usually made up of gold, silver, copper or aluminium to make these type of interconnections. Wire bonder machine playes an important role in the semiconductor devices assembly and packaging process, for consumer electronics, automotive, manufacturing and many other industrial applications for integrating the machines with technology based devices, thus boosts the demand of wire bonder equipment globally.


Rising demand of electronic devices in several applications has led to increase in the production of semiconductor and electronic devices, hence ulitimately driving the global wire bonder equipment market over the forecast period.  It is observed that owing to the growing necessity of the semiconductors in numerous sectors, the emergence of Integrated Device Manufacturers (IDMs), and Outsourced Semiconductor Assembly and Testing (OSATs) vendors have drastically increased in the market. New equipment manufacturers and suppliers are also anticipated to uplift the entire wire bonder machine market worldwide. Due to the emergence of new types of chip packaging technologies such as TSV packaging, MEMs packaging, the semiconductor packaging equipment like wire bonder equipment is anticipated to witness promising market growth in the near future.


However, the high level complexities in the manufacturing process of ICs and other chips, increases the probability of defects in the semiconductor devices, restraining the growth of the market in the forthcoming years. Also, lack of skilled wire bonding operator limits the production process, as it is his responsibility to attach the thin wire to the silicon die leading to the frame of interconnecting circuits. Gold bonding wire (GBW) plays an important role in the electronics sector for the semiconductor fabrication, wherein the increasing rates of gold is becoming a threat over the electronics market globally.


Key Market Driver -

• Rising semiconductor and electronics production and application • Increasing importance of semiconductor device fabrication • Growing developments in semiconductor packaging technologies

Key Market Restraint -

• Rising complexity and probability of defects in the semiconductors and electronic devices • Increasing price of gold, limiting gold bonding wire availability


Key Players Covered:


Key market players operating in the market are mainly focusing over commencing investments to uphold the devices and their respective latest technologies. The semiconductor industry is optimized by the customer and manufacturers relationship based sales and promotion strategies. Manufacturers truly focus over the ways that help them to develop long-lasting relations with their customers, by offering wide range products. Market players practice on building such relations to ensure repetitive purchases from their customers by offering incentives and huge discounts for the upcoming orders, therefore maintain their market position.


Some of the key competitors in the wire bonder equipment market include ASM Pacific Technology, Kulicke& Soffa, Palomar Technologies, Besi, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, West Bond, and others.


Regional Analysis


Asia Pacific(APAC) is expected to witness exponential growth rate in the near future, owing to the rapid shift towards the autonoumous and electric driving, thus enhancing the demand of semiconductors in the APAC automotive sector. Rising demand for the gold wire bonding (GBW) for the vehicle electronics, that caters reliability and tight safety requirements such as energy efficiency, safety regulations, driving information, emissions control, and driver assistance. North America and Europe are surging in the demand for sensors across several industries and their respective applications. Increasing demand of 3D sensors across U.S., UK, Germany, etc. has led tremendous growth in the wire bonder market across the North America and Europe. Application of 3D sensors is increasing in smartphones, media & entertainament, facicial recognition for security and surveillance systems, automotive systems, healthcare devices, and many more.


Middle east & Africa, and Latin American automotive and healthcare sectors are boosting the demand for the semiconductor devices, along with rising commercial 5G services that offer power amplification for the wireless communications, across both the regions. Emergence of grphic cards for crypto currency mining is driving tremendous demand for the semicondcutors; this in return is expected to uplift the wire bonder market in Middle east & Africa, and Latin America.


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Segmentation






















 ATTRIBUTE


  DETAILS

By Type




  • Ball Bonders

  • Stud-Bump Bonders

  • Wedge Bonders



By Application




  • Integrated Device Manufacturers (IDMs)

  • Outsourced Semiconductor Assembly and Testing (OSATs)



By Region




  • North America (U.S. and Canada)

  • Europe (UK, Spain, France, Italy, DACH, Benelux, Nordics, CIS and Rest of Europe)

  • Asia Pacific (Japan, China, India, South Korea, ASEAN, Oceania, and Rest of Asia Pacific)

  • Middle East & Africa (Turkey, South Africa, GCC, North Africa and Rest of the Middle East & Africa)

  • Latin America (South America, Central America, Caribbean and Rest of Latin America)



Key Industry Developments



  • April 2019: ASM Pacific Technology announced its agreement with the Jiujiang Municipal Government of Jiangxi Province for building a semiconductor materials plant in the Jiujiang Economic And Technological Development Zone

  • June 2020: Kulicke& Soffa announced its participation in the SEMICON China 2020 trade show, held in Shanghai, while exhibiting its new ULTRALUX automatic wire bonder, and  the POWER-C wedge bonder equipment with latest technologies


Wire Bonder Equipment Market Size, Share and Global Industry Trend Forecast till 2026
  • Ongoing
  • 2021
  • 2018-2020

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