Electronic Adhesives Market Size, Share & Industry Analysis, By Form (Liquid, Paste, Solid), By Resin Type (Epoxy, Silicone, Acrylic, PU, Others), By Application (Computers & servers, Communications, Consumer Electronics, Industrial, Medical, Automotive, Commercial Aviation) And Regional Forecast, 2024-2032

Adhesives are the a material, which serves as a binder between two surfaces and resists separation between them. Electronic adhesives are made from the raw material such as epoxies, silicones, cyanoacrylates, polyurethanes, and polysulfides. They are the part of the electronic components, which is utilized in the assembly and manufacture of electronic circuits and products. Moreover, these adhesives could also be adopted as coatings in order to protect the circuit board from harmful environmental factors including temperature moisture, fluctuations, and corrosion. They are mainly used in computers & servers, communications, consumer electronics, industrial, medical, and automotive industry.

The rapidly growing electronic industry will lead to fuel the growth in the electronic adhesive market during the review period. The upsurging demand for consumer goods, the introduction of next-generation wireless 5G infrastructure networks, and increasing demand for smartphones and other electronic devices are booming the electronic industry. Thereby aids to boost product consumption. Moreover, the properties such as better efficiency and are more cost-effective makes electrically conductive adhesives as a sustainable choice over conventional tin-lead solders. Hence, these factors will contribute to fuel market growth. 

However, fluctuations in raw material prices impact the overall demand for electronic devices. This restricts the product demand and is anticipated to restrain the market growth.

Market Segmentation:

Based on form, the electronic adhesives market is segmented into liquid, paste and solid. Based on resin type, the market is segmented into epoxy, silicone, acrylic, polyurathane, others. Based on application, the market is segmented into computers & servers, communications, consumer electronics, industrial, medical, automotive, and commercial aviation. From a geographical standpoint, the market is categorized into North America, Europe, Asia Pacific, Latin America, and the Middle East & Africa.  

Key Players Covered:

The key players in the electronic adhesives market include M Company, Alent PLC, BASF SE, H.B. Fuller Company, Henkel AG & Co. KGaA, Indium Corporation, LG Chemical Limited, Mitsui Chemicals, Hitachi Chemicals Company Limited, The Dow Chemicals Company, and Kyocera Chemical Corporation.

Key Insights

• Key Emerging Trends – For Major Countries


• Key Developments: Mergers, Acquisition, Partnership, etc.


• Latest Technological Advancement


• Insights on Regulatory Scenarios


• Porters Five Forces Analysis

Regional Analysis:

Asia Pacific is estimated to witness sustainable growth in the electronic adhesives market. The growth is attributed to the rising product demand in the medical industry. The increasing adoption of electronic adhesives from consumer electronics and communication will fuel the market growth in Europe. In North America, the US and Canada are the leading countries. The growth is due to the rising product demand in automotive and industrial applications. The Middle East & Africa is anticipated to witness significant growth, owing to the increasing product demand in the commercial aviation.

Segmentation

Electronic Adhesives Industry Developments

• In June 2019, Bostik introduced Born2Bond™, a new range of innovative engineering adhesives. The product is designed for ‘by-the-dot’ bonding applications in selected industries, such as electronics, automotive, medical devices, luxury packaging, and MRO. This launch will help the company to expand its product portfolio.


• In May 2018, Henkel launched Formnext, a materials and adhesive solutions for 3D Printing in Frankfurt. The new product will help the company to strengthen its positioning as a partner for end-to-end 3D printing processes.