Semiconductor Assembly and Packaging Equipment Market Size, Share & Industry Analysis, By Type (Die Bonders, Wire Bonders, Packaging Equipment, and Others), By Application (IDMs and OSAT), By End-Use Industry (Consumer Electronics, Automotive Electronics, Industrial Electronics, Medical Devices, Aerospace and Defense, and Others), and Regional Forecast, 2025 – 2032

ATTRIBUTE

DETAILS

Study Period

2019-2032

Base Year

2024

Forecast Period

2025-2032

Historical Period

2019-2023

Growth Rate

CAGR of 8.72% from 2025 to 2032

Unit

Value (USD Billion)

Segmentation

Type, Application, End-Use Industry and Region

Segmentation

By Type

• Die Bonders
• Wire Bonders
• Packaging Equipment

• Others

By Application

• IDMs
• OSAT

By End-Use Industry

• Consumer Electronics
• Automotive Electronics
• Industrial Electronics
• Medical Devices
• Aerospace and Defense
• Others

By Region

• North America (By Type, By Application, By End-Use Industry, and By Country)
  • U.S. (By Type)
  • Canada (By Type)
  • Mexico (By Type)
• Europe (By Type, By Application, By End-Use Industry, and By Country)
  • U.K. (By Type)
  • Germany (By Type)
  • France (By Type)
  • Italy (By Type)
  • Rest of Europe
• Asia Pacific (By Type, By Application, By End-Use Industry, and By Country)
  • China (By Type)
  • Japan (By Type)
  • India (By Type)
  • South Korea (By Type)
  • Rest of Asia Pacific
• Middle East & Africa (By Type, By Application, By End-Use Industry, and By Country)
  • GCC (By Type)
  • South Africa (By Type)
  • Rest of the Middle East & Africa
• South America (By Type, By Application, By End-Use Industry, and By Country)
  • Brazil (By Type)
  • Argentina (By Type)
  • Rest of South America

Companies Profiled in the Report

Kulicke and Soffa Industries, Inc., Besi, TOWA Corporation, SHINKAWA Electric Co., Ltd., Hana Micron, SUSS MicroTec SE, ASMPT (Singapore), ASM International (U.S.), Disco Corporation, Advantest Corporation