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System in Package (SiP) Market Size, Share, and COVID-19 Impact Analysis, By Packaging Technology (2D IC Packaging, 2.5D IC Packaging, 3D IC Packaging), By Packaging Method (Wire Bond, Flip Chip, Fan-out Water Level Packaging), By Application (Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, Others), and Regional Forecast, 2024-2032

Region : Global | Report ID: FBI107060 | Status : Ongoing



A system in the package is a technology that includes various semiconductors or integrated circuits (ICs) that dies with tremendous functionality into a single package that executes different functions. It’s a packaging method that enables several dies to be added to a single module. It combines assembling a printed circuit board even more (PCB) and multiple integrated circuits in a small package. SiP dies can be arranged horizontally and vertically with solder bumps or off-chip wire bonds. Due to increased efficiency and stability, SiP is primarily used in various industries such as automotive, consumer electronics, and telecommunications. SiP has improved from a niche technology with a par number of applications to a high-volume technology with a broad series of uses.

The growth of the system-in-package (SiP) market is driven by increased demand for internet-based compact electronics gadgets, increased Internet of Things (IoT) devices, and advanced 5G network-connected devices. Additionally, increased adoption of smart wearables boosts smartphones, propelling the market growth. Furthermore, the market is anticipated to grow due to increased demand for the miniaturization of electronic devices. Other significant factors influencing the market's growth rate include the increase in the adoption of SiP technology in gaming processors and graphic cards.

Impact of COVID-19 on the System in Package (SiP) Market

The outbreak of COVID-19 has significantly affected the semiconductor and electronics industry. Manufacturing and business units across multiple countries were closed in 2021, owing to increased COVID-19 cases, and are expected to closed in the second quarter of 2022. Furthermore, the complete or partial lockdown has interrupted the global supply chain posing challenges for manufacturers to reach customers. The global system in package (SiP) market is no exception. Moreover, consumer preferences have decreased as society focuses more on eliminating non-needed expenses from their financial plan to the broader economic situation. The mentioned factors are expected to negatively impact the global system in package (SiP) market's growth during the forecast period.

Key Insights

The report will cover the following key insights:

  • Micro Macro Economic Indicators.

  • Drivers, Restraints, Trends, and Opportunities.

  • Business Strategies Adopted by the Players.

  • Impact of COVID-19 on System in Package (SiP) Market.

  • Consolidated SWOT Analysis of Key Players.

Analysis by Packaging Method

The packaging method is further segmented into wire bond, flip chip (FC), and fan-out wafer level packaging (FOWLP). For instance, Intel, located in the U.S., was the primary user of flip chip packaging for packaging its CPUs to develop the thermal and electrical performance of the processors. The rising need for reduced package sizes and functionalities led to combining flip chip packaging methods in application processors and baseband for mobile platforms. Furthermore, FOWLP is a key packaging method for embedding heterogeneous devices such as RF transceivers, baseband processors, and power management ICs (PMICs). The rising demand for a large number of I/O points for semiconductor devices is expected to increase the need for the FOWLP packaging method.

Regional Analysis

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The Asia Pacific is expected to be the fastest expanding region owing to the increasing growth in consumer electronics. The demand for the SiP is more from the consumer electronics industry, mainly for tablets and smartphones. As a result, prominent companies in this sector, such as Sony (Japan), and Samsung Electronics (South Korea), are driving the system in the package market in the Asia Pacific region.

The distribution of the System in Package by region of origin is as follows:

  • North America – 26%

  • Europe – 17%

  • Asia Pacific – 45%

  • The Middle East and Africa – 7%

  • South America – 5%

Key Players Covered

The report will include the profiles of key players such as Samsung, Amkor Technology, Inc., ASE Group, ChipMOS Technologies, Inc., Unisem, UTAC, Intel Corporation, Fujitsu Ltd, Toshiba Electronics, SPIL, Powertech Technology, Inc., Renesas Electronics Corporation, Qualcomm, Inc., and others.


By Packaging Technology

By Packaging Method

By Application

By Geography

  • 2D IC Packaging

  • 2.5D IC Packaging

  • 3D IC Packaging

  • Wire Bond

  • Flip Chip

  • Fan-out Water Level Packaging

  • Consumer Electronics

  • Automotive

  • Telecommunication

  • Industrial System

  • Aerospace and Defense

  • Others

  • North America (U.S., Canada, and Mexico)

  • Europe (U.K., Germany, France, Italy, Spain, Russia, Benelux, Nordics, and Rest of Europe)

  • Asia Pacific (China, India, Japan, South Korea, ASEAN, Oceania, and Rest of Asia Pacific)

  • Middle East & Africa (Turkey, Israel, GCC, North Africa, South Africa, and Rest of MEA)

  • South America (Brazil, Argentina, and Rest of South America)

Key Industry Developments

  • November 2021 - Amkor Technology expanded its innovative packaging technology capacity with a factory located in Bac Ninh, Vietnam. This factory focused on offering innovative System in Package (SiP) assembly and test solutions to electronic and semiconductor manufacturing firms.

  • November 2020 - Apple’s Airpods 3 adopted the compact system in package solution. This enables Apple to pack more components in a smaller space conveniently.

  • Ongoing
  • 2023
  • 2019-2022


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