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A system in the package is a technology that includes various semiconductors or integrated circuits (ICs) that dies with tremendous functionality into a single package that executes different functions. It’s a packaging method that enables several dies to be added to a single module. It combines assembling a printed circuit board even more (PCB) and multiple integrated circuits in a small package. SiP dies can be arranged horizontally and vertically with solder bumps or off-chip wire bonds. Due to increased efficiency and stability, SiP is primarily used in various industries such as automotive, consumer electronics, and telecommunications. SiP has improved from a niche technology with a par number of applications to a high-volume technology with a broad series of uses.
The growth of the system-in-package (SiP) market is driven by increased demand for internet-based compact electronics gadgets, increased Internet of Things (IoT) devices, and advanced 5G network-connected devices. Additionally, increased adoption of smart wearables boosts smartphones, propelling the market growth. Furthermore, the market is anticipated to grow due to increased demand for the miniaturization of electronic devices. Other significant factors influencing the market's growth rate include the increase in the adoption of SiP technology in gaming processors and graphic cards.
The outbreak of COVID-19 has significantly affected the semiconductor and electronics industry. Manufacturing and business units across multiple countries were closed in 2021, owing to increased COVID-19 cases, and are expected to closed in the second quarter of 2022. Furthermore, the complete or partial lockdown has interrupted the global supply chain posing challenges for manufacturers to reach customers. The global system in package (SiP) market is no exception. Moreover, consumer preferences have decreased as society focuses more on eliminating non-needed expenses from their financial plan to the broader economic situation. The mentioned factors are expected to negatively impact the global system in package (SiP) market's growth during the forecast period.
The report will cover the following key insights:
The packaging method is further segmented into wire bond, flip chip (FC), and fan-out wafer level packaging (FOWLP). For instance, Intel, located in the U.S., was the primary user of flip chip packaging for packaging its CPUs to develop the thermal and electrical performance of the processors. The rising need for reduced package sizes and functionalities led to combining flip chip packaging methods in application processors and baseband for mobile platforms. Furthermore, FOWLP is a key packaging method for embedding heterogeneous devices such as RF transceivers, baseband processors, and power management ICs (PMICs). The rising demand for a large number of I/O points for semiconductor devices is expected to increase the need for the FOWLP packaging method.
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The Asia Pacific is expected to be the fastest expanding region owing to the increasing growth in consumer electronics. The demand for the SiP is more from the consumer electronics industry, mainly for tablets and smartphones. As a result, prominent companies in this sector, such as Sony (Japan), and Samsung Electronics (South Korea), are driving the system in the package market in the Asia Pacific region.
The distribution of the System in Package by region of origin is as follows:
The report will include the profiles of key players such as Samsung, Amkor Technology, Inc., ASE Group, ChipMOS Technologies, Inc., Unisem, UTAC, Intel Corporation, Fujitsu Ltd, Toshiba Electronics, SPIL, Powertech Technology, Inc., Renesas Electronics Corporation, Qualcomm, Inc., and others.
By Packaging Technology
By Packaging Method
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