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3D Semiconductor packaging is an updated and advanced technology of packing and stacking semiconductor chips together in two or more layers to stay interconnected horizontally and vertically and perform as a single device. Microelectronic devices opt for 3D semiconductor packaging due to its compact size, less power consumption, and improved efficiency, thus driving the market.
The semiconductor industry is rapidly growing with the evolving and emerging need for IoT devices. With digitization conquering the world and the internet penetrating every corner, the demand for portable and efficient semiconductors has increased enormously. The bolstering sales of semiconductors for consumer electronics worldwide drives the 3D semiconductor packaging market. For instance,
In addition, the rising adoption and use of electric vehicles worldwide are fueling the market growth. 3D semiconductors, being lightweight and able to condense multiple components into one solid piece, aids in producing electric vehicles. For instance,
The increasing demand for wireless, consumer wearable devices, smartphones, tablets, etc., drives the 3D packaging market. This provides new opportunities to emerging technologies like the Internet of Things, thus pushing the advanced packaging market.
The market has been negatively impacted due to the outbreak of COVID-19. The hardware supply chain faced disruptions due to the pandemic restrictions of lockdowns and shutdowns and curbing of trading activities.
However, the market witnessed a rise in demand in the healthcare sector post-pandemic. With enormous applications of 3D semiconductor packaging in medical devices, there was propulsion in developing advanced medical devices and equipment across the globe. Moreover, many medical equipment manufacturers increased their production after the pandemic, thus boosting the 3D packaging market. For instance,
Furthermore, the market is seeing opportunities in the aerospace sector with the rising implementation of the Through Silicon Via (TSV) interposer for saving space and weight. Thus, the adoption of 3D packaging in aeronautic applications boosts market growth.
The report will cover the following key insights:
Based on technology, the market includes fan out based, through silicon via (TSV), wire boned, and package on package (PoP). The TSV segment is expected to hold the largest share in the global 3D semiconductor packaging market owing to the higher space efficiency and interconnectivity features.
Emerging technologies such as machine learning, cloud computing, and artificial intelligence require high-performance computing applications for which TSV technology provides lucrative solutions. It bolsters and drives the demand for the 3D semiconductor packaging market. For instance,
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The global 3D semiconductor packaging market is divided into five regions: North America, Europe, Asia Pacific, Middle East & Africa, and South America. Asia-Pacific holds the largest share in the market owing to the presence of many OEMs and leading manufacturers in the region, including China, Japan, Taiwan, and South Korea. Many investments are made into the semiconductor chip industry, thus propelling growth in this region. For instance,
The distribution of the global 3D semiconductor packaging market by region of origin is as follows:
The key players in the market include Intel Corporation, 3M Company, IBM Corporation, Qualcomm Technologies, Inc., Taiwan Semiconductor Manufacturing Company, Samsung Electronics Co. Ltd., Advanced Micro Devices, Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Toshiba Corp., Micron Technology, ASE Group, Suss Microtec AG, Siliconware Precision Industries Co. Ltd (SPIL) and others.
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