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Hermetic Packaging Market Size, Share & Industry Analysis, By Type (Co-fired Ceramic, Metal Can, Epoxy Seal, Ceramic Metal Sealing, and Glass Metal Sealing), By Application (Sensors, Photo Diodes, MEMS, Transistors, Laser Chips, Memory, and Others), By End-use Industry (Aerospace & Defense, Healthcare, Automotive, Electrical & Electronics, Telecom, and Others), and Regional Forecast, 2024-2032

Last Updated: July 01, 2024 | Format: PDF | Report ID: FBI109188

 

KEY MARKET INSIGHTS

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The global hermetic packaging market size was valued at USD 3.95 billion in 2023 and is projected to grow from USD 4.21 billion in 2024 to USD 7.31 billion by 2032, exhibiting a CAGR of 7.14% during the forecast period. Asia Pacific dominated the hermetic packaging market with a market share of 61.77% in 2023.


Hermetic packaging is used for all applications where electronic components protect it from corrosive environments to ensure acceptable service life. The increasing research and development activities in the aerospace and defense sector, leading to the increased use of packaging solutions, are contributing to global hermetic packaging growth. The packaging is used in many medical and electronic devices for safe and dependable packaging, which prolongs the service life of electrical components. Demand for electronics is expected to rise in internet usage among customers and increase government support for promoting digitalization, pushing customers to adopt various electronic devices, which strengthens the market’s growth.


The market has been negatively affected by the COVID-19 pandemic. The closure of retail stores and transport services affected the demand for hermetically packaged electronic components. However, the rising demand from aerospace & defense, automotive, and electrical & electronics during the post-pandemic era is anticipated to boost market growth.


Hermetic Packaging Market Trends


Increasing Focus on Sustainable Packaging Solutions to Mitigate Environmental Issues is emerging as a New Trend


The development of advanced materials and production technologies has enabled the manufacturing of hermetic packages with improved high performance and reduced costs. The trend toward reduction of electronic devices has led to the development of smaller, more compact electronic components. The packaging enables the miniaturization of electronic devices by providing a compact and reliable enclosure of the components.


Furthermore, there is a discernible trend in the use of sustainable packaging solutions, which incorporate environmentally conscious materials and production techniques to mitigate environmental issues. New developments in sealing technology and the introduction of innovative uses, such as spur innovation, quantum computing, and IoT devices in packaging methods, are expected to boost market growth.


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Hermetic Packaging Market Growth Factors


Aerospace and Electronics Industries Embrace Hermetic Seals for Enhanced Component Protection


Hermetic packaging shields products against various environmental threats, such as humidity, moisture, grime, soil under atmospheric pressure and other natural hazards that could harm delicate electronics or interrupt electrical connections within hermetic products. Product applications that are disrupted could result in disastrous outcomes, are vulnerable to harsh environmental circumstances, and need to be hermetically sealed. The aerospace industry uses hermetic packaging seals in many systems within an airplane.


The packaging is used to ensure that the integrity of delicate electronics within a box is maintained. The rising uptake of packaging solutions to safeguard extremely delicate electronic components is notably high and anticipated to escalate further in the forecast period.


Increasing Adoption of Consumer Electronics to Drive Market Growth


The use of consumer electronics is increasing the use of hermetic packaging solutions. Factors such as increasing purchasing power and strong economic growth are boosting the demand for smartphones, which will eventually upsurge the demand for packaging. Advancements in wireless mobile telecommunication technology, such as 4G, IoT, and 5G, will also boost the adoption of other smart devices.


Furthermore, the introduction of innovative household products in the market is likely to boost product consumption. Appliances equipped with voice assistance and Wi-Fi connectivity are being used due to their greater convenience. As a result of all these factors, consumer electronics is expected to drive the consumption of hermetic packaging and is anticipated to increase market growth in the coming years.


RESTRAINING FACTORS


Emergence of Not Quite or Almost Hermetic Packaging is Restraining Market Growth


Hermetic packages, which are made from polymeric material as opposed to ceramics, metals and glasses that are also known by other names, such as not quite or almost hermetic and quasi hermetic, are expected to hinder market growth. These packaging approaches hold the promise of reliable alternatives for the market if manufactured, designed, and tested properly. Owing to the benefits of near packaging, such as lightweight, lower cost and size, coupled with the anticipated increase in production and the development of standardization, it is expected to be operating in the packaging, especially for products that do not have a high cost of system letdown relative to the packaging costs. Such factors are anticipated to restrain the hermetic packaging market growth.


Hermetic Packaging Market Segmentation Analysis


By Type Analysis


Rising Demand for Complex Electronic Circuits Boosts Ceramic Metal Sealing Segment Growth


Based on type, the market is segmented into co-fired ceramic, metal can, epoxy seal, ceramic metal sealing, and glass metal sealing.


The ceramic metal sealing segment holds the largest market share. The segment is being increasingly utilized in implantable electronic devices. The rising demand for complex electronic circuits, such as microelectromechanical systems' multilayer ceramic metal sealing, is driving segment growth. Ceramic packaging offers superior hermetic protection compared to other materials, which is boosting the segment growth.


Glass metal sealing holds the second largest share of the segment due to its complex, extremely effective production process. Metal sealing is essential for the durable gas-tightness of the seal, and it is used for high-temperature variations.


By Application Analysis


Increasing Need for Hermetic Packaging that Offers Excellent Heat Dissipation and High Optical Precision Boosts Sensors Segment Growth


Based on application, the market is segmented into sensors, photodiodes, MEMS, transistors, laser chips, memory, and others.


The sensors segment holds the largest market share as sensors require packaging that offers excellent heat dissipation and high optical precision. The need for suitable packaging strategies for these sensor technologies boosts the use of packaging solutions and propels segment growth.


By End-use Industry Analysis


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Increase in Security Threats Fuels Aerospace & Defense Segment Growth


Based on end-use industry, the market is segmented into aerospace & defense, healthcare, automotive, electrical & electronics, telecom, and others.


The aerospace & defense segment holds the largest market share owing to growing security threats, changing political dynamics, and escalating defense budgets. Further, the rising government and private investments in space exploration are expected to drive the segment’s growth.


Automotive holds the second largest share of the segment due to the increased demand for electric vehicles and self-driving cars. Hermetic seals maintain sensor functionality in rollover devices and airbag equipment, which is boosting the segment's growth.


REGIONAL INSIGHTS


The market is studied across Europe, Latin America, North America, Asia Pacific, and the Middle East & Africa.


Asia Pacific Hermetic Packaging Market Size, 2023 (USD Billion)

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Asia Pacific dominates the global hermetic packaging market. The production of many electronic devices and components, coupled with the increased government budget for the aerospace & defense sector, particularly in China and Japan, has led to the high demand for the product in the region.


North America holds the second-largest global hermetic packaging market share, with aeronautics being one of the major end-use industries of packaging solutions. The industry is likely to offer huge chances for market growth on account of the occurrence of many aerospace companies in the region.


Europe is anticipated to have significant growth due to the region being home to some of the world’s largest automotive manufacturers, which invest in electric cars and self-driving advanced technology that requires high-performance engines and electronics. The increasing research and development activities within the space and automotive sectors are expected to boost market growth in the region over the forecast period.


Latin America is expected to have moderate growth owing to the increasing consumer spending on consumer electronics, coupled with the increased penetration of smart communication devices, such as smartphones, which is expected to fuel the demand for packaging solutions in the region.


The Middle East & Africa are expected to have stable growth owing to the strategic partnerships, mergers, acquisitions, and increasing research & development activities by players who are able to attain a strong foothold in the region.


List of Key Companies in Hermetic Packaging Market


Leading Companies Emphasize Innovative Packaging Offerings to Make a Mark in the Market


The global hermetic packaging market is highly fragmented and competitive. Some key companies focus on providing innovative packaging in the packaging industry to gain a strong foothold in the market. They are continuously concentrating on innovation and expanding their customer base across regions.


TELEDYNE, SCHOTT, Amkor Technology, Inc., KYOCERA Corporation, Materion Corporation, Egide, SGA Technologies, Complete Hermetics, Coat-X SA, Mackin Technologies, and others are some major market participants. Numerous other players operating in the industry are focused on delivering advanced packaging solutions.


List of Key Companies Profiled:



  • TELEDYNE (U.S.)

  • SCHOTT (Germany)

  • Amkor Technology, Inc. (U.S.)

  • KYOCERA Corporation (Japan)

  • Materion Corporation (U.S.)

  • Egide (France)

  • SGA Technologies (U.K.)

  • Complete Hermetics (U.S.)

  • Willow Technologies Ltd. (U.K.)

  • Mackin Technologies (Japan)


KEY INDUSTRY DEVELOPMENTS:



  • August 2023 – EPC Space launched new rad-hard GaN devices. The company introduced two new rad-hard GaN transistors with ultra-low resistance and high current capability for high-power density solutions. These devices are available in hermetic packages in very small footprints.

  • October 2022 – Hermetic Solutions Group acquired the RHP DiaCool Intellectual Property. The acquisition of this high-performance thermal material opens a new chapter for Hermetic Solutions Group, providing the ability to own and build DiaCool in HSG facilities and offering next-generation solutions to the customers' product designs.

  • May 2021 – GEA Heating & Refrigeration Technologies continues to develop its semi-hermetic product portfolio. The company launched two new screw compressor models, the GEA 350 and 400. The company also launched the brand new GEA Grasso X semi-hermetic screw compressor packages.

  • January 2021 MacDermid Alpha Electronics Solutions released STAYDRY H2-3000PSA, a hydrogen and moisture getter for hermetic packages. The product adds a newly developed proprietary adhesive that meets rigid outgassing and adhesion testing for medical, telecom and aerospace applications.

  • January 2020 – MacDermid Alpha Electronics Solutions announced the release of STAYDRY Z20 Moisture Getter for hermetic packages. The product is a silicone film moisture getter with a newly developed proprietary backing adhesive that meets rigid outgassing and adhesion testing for telecom, aerospace, and medical sectors, meeting MIL-STD 883, Method 5011.6.


REPORT COVERAGE


An Infographic Representation of Hermetic Packaging Market

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The report provides a detailed market analysis and focuses on key aspects such as leading companies, competitive landscape, product/service types, Porter's five forces analysis, market shares, and leading applications of the product. Besides, the report offers insights into the market trends and highlights key industry developments. In addition to the above factors, the report encompasses several factors that contributed to the market's growth in recent years.


Report Scope & Segmentation



















































ATTRIBUTE



DETAILS



Study Period



2019-2032



Base Year



2023



Estimated Year



2024



Forecast Period



2024-2032



Historical Period



2019-2022



Growth Rate



CAGR of 7.14% from 2024 to 2032



Unit



Value (USD Billion)



Segmentation



By Type



  • Co-fired Ceramic

  • Metal Can

  • Epoxy Seal

  • Ceramic Metal Sealing

  • Glass Metal Sealing



By Application



  • Sensors

  • Photo Diodes

  • MEMS

  • Transistors

  • Laser Chips

  • Memory

  • Others



By End-use Industry



  • Aerospace & Defense

  • Healthcare

  • Automotive

  • Electrical & Electronics

  • Telecom

  • Others



By Region



  • North America (By Type, Application, End-use Industry, and Country)


    • U.S. (By End-use Industry)

    • Canada (By End-use Industry)


  • Europe (By Type, Application, End-use Industry, and Country)


    • Germany (By End-use Industry)

    • France (By End-use Industry)

    • U.K. (By End-use Industry)

    • Italy (By End-use Industry)

    • Spain (By End-use Industry)

    • Russia (By End-use Industry)

    • Poland (By End-use Industry)

    • Romania (By End-use Industry)

    • Rest of Europe (By End-use Industry)


  • Asia Pacific (By Type, Application, End-use Industry, and Country)


    • China (By End-use Industry)

    • India (By End-use Industry)

    • Japan (By End-use Industry)

    • Australia (By End-use Industry)

    • South Korea (By End-use Industry)

    • Southeast Asia (By End-use Industry)

    • Rest of Asia Pacific (By End-use Industry)


  • Latin America (By Type, Application, End-use Industry, and Country)


    • Brazil (By End-use Industry)

    • Mexico (By End-use Industry)

    • Argentina (By End-use Industry)

    • Rest of Latin America (By End-use Industry)


  • Middle East & Africa (By Type, Application, End-use Industry, and Country)


    • Saudi Arabia (By End-use Industry)

    • UAE (By End-use Industry)

    • Oman (By End-use Industry)

    • South Africa (By End-use Industry)

    • Rest of the Middle East & Africa (By End-use Industry)







Frequently Asked Questions

The Fortune Business Insights study shows that the global market was USD 3.95 billion in 2023.

The global market is projected to grow at a compound annual CAGR of 7.14% over the forecast period.

The market size of Asia Pacific stood at USD 2.44 billion in 2023.

The aerospace & defense segment dominates the global market share.

The global market size is expected to reach USD 7.31 billion by 2032.

The key market drivers are the increasing use of hermetic packaging for protecting highly sensitive electronic components and the increasing adoption of consumer electronics.

The top players in the market are TELEDYNE, SCHOTT, Amkor Technology, Inc., KYOCERA Corporation, and Materion Corporation, among others.

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